Vol. 14, Issue 2, 2017April 01, 2017 EDT
Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers
Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers
Kaestle, Christopher, Aarief Syed-Khaja, and Joerg Franke. 2017. “Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers.” Journal of Microelectronics and Electronic Packaging 14 (2): 63–69. https://doi.org/10.4071/imaps.453827.