Vol. 14, Issue 2, 2017April 01, 2017 EDT
Reliable Young’s Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method
Reliable Young’s Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method
Kammuri, Kazuki, Atsushi Miki, and Hiroki Takeuchi. 2017. “Reliable Young’s Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method.” Journal of Microelectronics and Electronic Packaging 14 (2): 70–76. https://doi.org/10.4071/imaps.454688.