ISSN 1551-4897
Vol. 14, Issue 4, 2017October 01, 2017 EDT
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
Articles in Vol. 14, Issue 4, 2017
Vol. 14, Issue 4, 2017
- Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)John LauMing LiNelson FanEric KuahZhang LiKim Hwee TanTony ChenIris XuMargie LiY. M. CheungWu KaiJi HaoRozalia BeicaTom TaylorCT KoHenry YangY. H. ChenSze Pei LimN. C. LeeJiang RanKoh Sau WeeQingxiang YongCao XiMian TaoJeffery LoRicky Lee
- Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible ElectronicsMichael J. RennMatthew SchrandtJaxon RennJames Q. Feng
- Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry FilmJingru DaiJianfeng LiPearl AgyakwaChristopher Mark Johnson
- A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic CapacitorsJohn BultitudeJohn McConnellLonnie JonesGalen MillerJim MageeAllen TempletonAbhijit GuravReggie Phillips
- An Advanced Extreme-Environment Wireless Telemetry System for Turbine Blade InstrumentationJohn R. FraleyBrett SparkmanStephen MindenAnand KulkarniJoshua McConkey
- Evaluation of Printed-Circuit Board Materials for High-Temperature OperationOriol Aviño-SalvadoWissam SabbahCyril ButtayHervé MorelPascal Bevilacqua
Lau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, et al. 2017. “Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs).” Journal of Microelectronics and Electronic Packaging 14 (4): 123–31. https://doi.org/10.4071/imaps.522798.