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Vol. 14, Issue 4, 2017October 01, 2017 EDT

Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film

Jingru Dai, Jianfeng Li, Pearl Agyakwa, Christopher Mark Johnson,
Sintered die attachmentefficient manufacturingnanosilver filmporosityshear strengthstatistical analysisdata fitting
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.521776
Journal of Microelectronics & Elect Pkg
Dai, Jingru, Jianfeng Li, Pearl Agyakwa, and Christopher Mark Johnson. 2017. “Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film.” Journal of Microelectronics and Electronic Packaging 14 (4): 140–49. https:/​/​doi.org/​10.4071/​imaps.521776.
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