A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors

Bultitude, John, John McConnell, Lonnie Jones, Galen Miller, Jim Magee, Allen Templeton, Abhijit Gurav, and Reggie Phillips. 2017. “A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors.” Journal of Microelectronics and Electronic Packaging 14 (4): 150–57. https:/​/​doi.org/​10.4071/​imaps.522150.