A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors

John Bultitude; John McConnell; Lonnie Jones; Galen Miller; Jim Magee; Allen Templeton; Abhijit Gurav; Reggie Phillips

doi:10.4071/imaps.522150

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Bultitude, John, John McConnell, Lonnie Jones, Galen Miller, Jim Magee, Allen Templeton, Abhijit Gurav, and Reggie Phillips. 2017. “A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors.” Journal of Microelectronics and Electronic Packaging 14 (4): 150–57. https://doi.org/10.4071/imaps.522150.

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