Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

Oriol Aviño-Salvado; Wissam Sabbah; Cyril Buttay; Hervé Morel; Pascal Bevilacqua

doi:10.4071/imaps.516313

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Aviño-Salvado, Oriol, Wissam Sabbah, Cyril Buttay, Hervé Morel, and Pascal Bevilacqua. 2017. “Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.” Journal of Microelectronics and Electronic Packaging 14 (4): 166–71. https://doi.org/10.4071/imaps.516313.

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