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Vol. 14, Issue 4, 2017October 01, 2017 EDT

Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

Oriol Aviño-Salvado, Wissam Sabbah, Cyril Buttay, Hervé Morel, Pascal Bevilacqua,
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Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.516313
Journal of Microelectronics & Elect Pkg
Aviño-Salvado, Oriol, Wissam Sabbah, Cyril Buttay, Hervé Morel, and Pascal Bevilacqua. 2017. “Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.” Journal of Microelectronics and Electronic Packaging 14 (4): 166–71. https:/​/​doi.org/​10.4071/​imaps.516313.
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