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Vol. 15, Issue 2, 2018April 01, 2018 EDT

LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

Rainer Dohle, Ilaria Sacco, Thomas Rittweg, Thomas Friedrich, Gerold Henning, Jörg Goßler, Peter Fischer,
LTCCliquid coolingthermal managementPET/MRISiPM
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.562590
Journal of Microelectronics & Elect Pkg
Dohle, Rainer, Ilaria Sacco, Thomas Rittweg, Thomas Friedrich, Gerold Henning, Jörg Goßler, and Peter Fischer. 2018. “LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging.” Journal of Microelectronics and Electronic Packaging 15 (2): 86–94. https:/​/​doi.org/​10.4071/​imaps.562590.
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