ISSN 1551-4897
Vol. 15, Issue 2, 2018April 01, 2018 EDT
Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation
Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation
Misrak, Abel, Luu Nguyen, Steven Kummerl, and Dereje Agonafer. 2018. “Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation.” Journal of Microelectronics and Electronic Packaging 15 (2): 95–100. https://doi.org/10.4071/imaps.654387.