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Vol. 15, Issue 2, 2018April 01, 2018 EDT

Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

Abel Misrak, Luu Nguyen, Steven Kummerl, Dereje Agonafer,
Nanoindentationprinted circuit boardsreliabilityatomic force microscopyviscoelasticitycreep test
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.654387
Journal of Microelectronics & Elect Pkg
Misrak, Abel, Luu Nguyen, Steven Kummerl, and Dereje Agonafer. 2018. “Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation.” Journal of Microelectronics and Electronic Packaging 15 (2): 95–100. https:/​/​doi.org/​10.4071/​imaps.654387.
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