Vol. 15, Issue 2, 2018April 01, 2018 EDT
Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review
Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review
Thanu, Dinesh P. R., Boxi Liu, and Marco Aurelio Cartas. 2018. “Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review.” Journal of Microelectronics and Electronic Packaging 15 (2): 63–74. https://doi.org/10.4071/imaps.654289.