Vol. 15, Issue 1, 2018January 01, 2018 EDT
Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications
Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications
Novikov, A., and M. Nowottnick. 2018. “Thermal Stability of Intermetallic Cu–Sn Interconnections for High Temperature Applications.” Journal of Microelectronics and Electronic Packaging 15 (1): 35–40. https://doi.org/10.4071/imaps.529384.