Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

Thomas F. Marinis; Joseph W. Soucy

doi:10.4071/imaps.526636

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Marinis, Thomas F., and Joseph W. Soucy. 2018. “Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.” Journal of Microelectronics and Electronic Packaging 15 (1): 9–20. https://doi.org/10.4071/imaps.526636.

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