3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components

Zihan Wu; Junki Min; Markondeya Raj Pulugurtha; Siddharth Ravichandran; Venky Sundaram; Rao R. Tummala

doi:10.4071/imaps.656641

Wu, Zihan, Junki Min, Markondeya Raj Pulugurtha, Siddharth Ravichandran, Venky Sundaram, and Rao R. Tummala. 2018. “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components.” Journal of Microelectronics and Electronic Packaging 15 (3): 107–16. https://doi.org/10.4071/imaps.656641.

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