3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components

Wu, Zihan, Junki Min, Markondeya Raj Pulugurtha, Siddharth Ravichandran, Venky Sundaram, and Rao R. Tummala. 2018. “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components.” Journal of Microelectronics and Electronic Packaging 15 (3): 107–16. https:/​/​doi.org/​10.4071/​imaps.656641.