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Vol. 15, Issue 3, 2018July 01, 2018 EDT

3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components

Zihan Wu, Junki Min, Markondeya Raj Pulugurtha, Siddharth Ravichandran, Venky Sundaram, Rao R. Tummala,
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Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.656641
Journal of Microelectronics & Elect Pkg
Wu, Zihan, Junki Min, Markondeya Raj Pulugurtha, Siddharth Ravichandran, Venky Sundaram, and Rao R. Tummala. 2018. “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components.” Journal of Microelectronics and Electronic Packaging 15 (3): 107–16. https:/​/​doi.org/​10.4071/​imaps.656641.
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