Vol. 8, Issue 1, 2011January 01, 2011 EDT
The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags
The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags
Saarinen, Kirsi, and Laura Frisk. 2011. “The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID Tags.” Journal of Microelectronics and Electronic Packaging 8 (1): 10–15. https://doi.org/10.4071/imaps.279.