This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:9307/feed
ISSN 1551-4897
General
Vol. 8, Issue 1, 2011January 01, 2011 EDT

An Investigation of the Process Stability of RF SiP Made of DuPont 943 and 9K7

Thomas Bartnitzek, Tatyana Purtova, Christian Rusch, Slawomir Kaminski, Till Feger,
RF packagessystem-in-packageLTCCpostprocessingrefiring
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.287
Journal of Microelectronics & Elect Pkg
Bartnitzek, Thomas, Tatyana Purtova, Christian Rusch, Slawomir Kaminski, and Till Feger. 2011. “An Investigation of the Process Stability of RF SiP Made of DuPont 943 and 9K7.” Journal of Microelectronics and Electronic Packaging 8 (1): 34–41. https:/​/​doi.org/​10.4071/​imaps.287.

View more stats

Powered by Scholastica, the modern academic journal management system