ISSN 1551-4897
Vol. 8, Issue 1, 2011January 01, 2011 EDT
Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement
Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement
Articles in Vol. 8, Issue 1, 2011
Vol. 8, Issue 1, 2011
- Determination of Electric and Magnetic Properties of Commercial LTCC Soft Ferrite MaterialNelu BlažAndrea MarićGoran RadosavljevićNebojša MitrovićIbrahim AtassiWalter SmetanaLjiljana Živanov
- The Effects of Temperature Profile of Accelerated Temperature Cycling Tests on the Reliability of ACA Joints in RFID TagsKirsi SaarinenLaura Frisk
- Design of a High Temperature EMI Input Filter for a 2 kW HVDC-Fed InverterRémi RobutelChristian MartinHervé MorelCyril ButtayNicolas GazelDominique Bergogne
- Qualification of Fiber Optic Cables for Martian Extreme Temperature EnvironmentsRajeshuni RameshamWilliam T. RobertsChristian A. LindensmithRichard Rainen
- An Investigation of the Process Stability of RF SiP Made of DuPont 943 and 9K7Thomas BartnitzekTatyana PurtovaChristian RuschSlawomir KaminskiTill Feger
- Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow ArrangementPradeep HegdeMukesh PatilK. N. Seetharamu
Hegde, Pradeep, Mukesh Patil, and K. N. Seetharamu. 2011. “Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement.” Journal of Microelectronics and Electronic Packaging 8 (1): 16–22. https://doi.org/10.4071/imaps.276.