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Vol. 8, Issue 1, 2011January 01, 2011 EDT

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

Pradeep Hegde, Mukesh Patil, K. N. Seetharamu,
finite element methodpumping powermicrochannelstacked heat sinkthermal resistance
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.276
Journal of Microelectronics & Elect Pkg
Hegde, Pradeep, Mukesh Patil, and K. N. Seetharamu. 2011. “Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement.” Journal of Microelectronics and Electronic Packaging 8 (1): 16–22. https:/​/​doi.org/​10.4071/​imaps.276.
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