New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography

M. Faqir; A. Manoi; T. Mrotzek; S. Knippscheer; M. Massiot; M. Buchta; H. Blanck; S. Rochette; O. Vendier; M. Kuball

doi:10.4071/imaps.297

Faqir, M., A. Manoi, T. Mrotzek, S. Knippscheer, M. Massiot, M. Buchta, H. Blanck, S. Rochette, O. Vendier, and M. Kuball. 2011. “New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography.” Journal of Microelectronics and Electronic Packaging 8 (3): 110–13. https://doi.org/10.4071/imaps.297.

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