New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography

Faqir, M., A. Manoi, T. Mrotzek, S. Knippscheer, M. Massiot, M. Buchta, H. Blanck, S. Rochette, O. Vendier, and M. Kuball. 2011. “New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography.” Journal of Microelectronics and Electronic Packaging 8 (3): 110–13. https:/​/​doi.org/​10.4071/​imaps.297.