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Vol. 8, Issue 4, 2011October 01, 2011 EDT

Assessment and Characterization of Stress Induced by Via-First TSV Technology

G. Parès, F. De Crecy, S. Moreau, C. Maurice, A. Borbely, J. Mazuir, L.L. Chapelon, N. Sillon,
CopperFEM simulationphysical characterizationpolysiliconstressTSVtungstenvia-first
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.313
Journal of Microelectronics & Elect Pkg
Parès, G., F. De Crecy, S. Moreau, C. Maurice, A. Borbely, J. Mazuir, L.L. Chapelon, and N. Sillon. 2011. “Assessment and Characterization of Stress Induced by Via-First TSV Technology.” Journal of Microelectronics and Electronic Packaging 8 (4): 129–39. https:/​/​doi.org/​10.4071/​imaps.313.
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