Assessment and Characterization of Stress Induced by Via-First TSV Technology

Parès, G., F. De Crecy, S. Moreau, C. Maurice, A. Borbely, J. Mazuir, L.L. Chapelon, and N. Sillon. 2011. “Assessment and Characterization of Stress Induced by Via-First TSV Technology.” Journal of Microelectronics and Electronic Packaging 8 (4): 129–39. https:/​/​doi.org/​10.4071/​imaps.313.