Vol. 8, Issue 4, 2011October 01, 2011 EDT
Assessment and Characterization of Stress Induced by Via-First TSV Technology
Assessment and Characterization of Stress Induced by Via-First TSV Technology
Parès, G., F. De Crecy, S. Moreau, C. Maurice, A. Borbely, J. Mazuir, L.L. Chapelon, and N. Sillon. 2011. “Assessment and Characterization of Stress Induced by Via-First TSV Technology.” Journal of Microelectronics and Electronic Packaging 8 (4): 129–39. https://doi.org/10.4071/imaps.313.