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Vol. 8, Issue 3, 2011July 01, 2011 EDT

Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain Reflectometry

K. Webb, H. Song,
Compensation schemeintegrated circuitpackagetime domain reflectometrywirebond
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.301
Journal of Microelectronics & Elect Pkg
Webb, K., and H. Song. 2011. “Compensation Scheme of a 50 Ω Bond Wire Interconnect Using Time Domain Reflectometry.” Journal of Microelectronics and Electronic Packaging 8 (3): 114–20. https:/​/​doi.org/​10.4071/​imaps.301.
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