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Vol. 8, Issue 4, 2011October 01, 2011 EDT

An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration

Shyh-Shyuan Sheu, Zhe-Hui Lin, Jui-Feng Hung, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Keng-Li Su, Chih-Sheng Lin, Shinn-Juh Lai, Kuo-Hsing Cheng, Tzu-Kun Ku, Wei-Chung Lo, Ming-Jer Kao,
3D IC integrationthrough silicon via (TSV)TSV electrical testing method and guidelines
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.307
Journal of Microelectronics & Elect Pkg
Sheu, Shyh-Shyuan, Zhe-Hui Lin, Jui-Feng Hung, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Keng-Li Su, et al. 2011. “An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration.” Journal of Microelectronics and Electronic Packaging 8 (4): 140–45. https:/​/​doi.org/​10.4071/​imaps.307.
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