Vol. 8, Issue 4, 2011October 01, 2011 EDT
An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration
An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration
Sheu, Shyh-Shyuan, Zhe-Hui Lin, Jui-Feng Hung, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Keng-Li Su, et al. 2011. “An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration.” Journal of Microelectronics and Electronic Packaging 8 (4): 140–45. https://doi.org/10.4071/imaps.307.