An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration

Sheu, Shyh-Shyuan, Zhe-Hui Lin, Jui-Feng Hung, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Keng-Li Su, et al. 2011. “An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration.” Journal of Microelectronics and Electronic Packaging 8 (4): 140–45. https://doi.org/10.4071/imaps.307.