Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

Jonathan Tamil; Siew Hoon Ore; Kian Yeow Gan; Drake Koh; Michael Gantalao Ti In; Boon Pek Liew; Teck Wah Park; Geraldine Ng; Yong Bo Yang; Daniel Teh; Nathapong Suthiwongsunthorn; Surasit Chungpaiboonpatana

doi:10.4071/imaps.319

Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Drake Koh, Michael Gantalao Ti In, Boon Pek Liew, Teck Wah Park, et al. 2012. “Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology.” Journal of Microelectronics and Electronic Packaging 9 (1): 19–30. https://doi.org/10.4071/imaps.319.

View more stats