Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Drake Koh, Michael Gantalao Ti In, Boon Pek Liew, Teck Wah Park, et al. 2012. “Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology.” Journal of Microelectronics and Electronic Packaging 9 (1): 19–30. https:/​/​doi.org/​10.4071/​imaps.319.