ISSN 1551-4897
La Manna, Antonio, K. J. Rebibis, C. Gerets, and E. Beyne. 2012. “Use of Wafer Applied Underfill for 3D Stacking.” Journal of Microelectronics and Electronic Packaging 9 (1): 10–18. https://doi.org/10.4071/imaps.317.
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