Reliability of Embedded Ultrathin Chips Subjected to Cyclic Stresses

Ferdous Sarwar; Val R. Marinov

doi:10.4071/imaps.330

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Sarwar, Ferdous, and Val R. Marinov. 2012. “Reliability of Embedded Ultrathin Chips Subjected to Cyclic Stresses.” Journal of Microelectronics and Electronic Packaging 9 (2): 104–11. https://doi.org/10.4071/imaps.330.

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