Vol. 9, Issue 2, 2012April 01, 2012 EDT
Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs
Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs
Kostka, Darryl, and Antonio Ciccomancini Scogna. 2012. “Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs.” Journal of Microelectronics and Electronic Packaging 9 (2): 52–64. https://doi.org/10.4071/imaps.318.