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Vol. 9, Issue 2, 2012April 01, 2012 EDT

Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs

Darryl Kostka, Antonio Ciccomancini Scogna,
return current pathviassignal integritypackagePCB
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.318
Journal of Microelectronics & Elect Pkg
Kostka, Darryl, and Antonio Ciccomancini Scogna. 2012. “Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs.” Journal of Microelectronics and Electronic Packaging 9 (2): 52–64. https:/​/​doi.org/​10.4071/​imaps.318.
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