Vol. 9, Issue 2, 2012April 01, 2012 EDT
Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application
Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application
Tran, Tu Anh, Varughese Mathew, and Harold Downey. 2012. “Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application.” Journal of Microelectronics and Electronic Packaging 9 (2): 65–77. https://doi.org/10.4071/imaps.325.