Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:10836/feed
General
Vol. 9, Issue 4, 2012October 01, 2012 EDT

Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

Quanling Zheng, M. Ashraf Khan, Alfred M. Kriman, Gary H. Bernstein,
Pull testquilt packaging (QP)self-inductancesolder paste
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.359
Journal of Microelectronics & Elect Pkg
Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. 2012. “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.” Journal of Microelectronics and Electronic Packaging 9 (4): 160–65. https:/​/​doi.org/​10.4071/​imaps.359.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system