Vol. 9, Issue 4, 2012October 01, 2012 EDT
Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. 2012. “Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.” Journal of Microelectronics and Electronic Packaging 9 (4): 160–65. https://doi.org/10.4071/imaps.359.