Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

Chien, Heng-Chieh, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, and Ming-Jer Kao. 2012. “Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).” Journal of Microelectronics and Electronic Packaging 9 (2): 97–103. https://doi.org/10.4071/imaps.309.