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Vol. 9, Issue 2, 2012April 01, 2012 EDT

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

Heng-Chieh Chien, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, Ming-Jer Kao,
3D IC integrationequivalent thermal conductivities of Cu-filled TSVsSiO2through silicon via (TSV)
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.309
Journal of Microelectronics & Elect Pkg
Chien, Heng-Chieh, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, and Ming-Jer Kao. 2012. “Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).” Journal of Microelectronics and Electronic Packaging 9 (2): 97–103. https:/​/​doi.org/​10.4071/​imaps.309.
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