Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes

K.-F. Becker; D. Joklitschke; T. Braun; M. Koch; T. Thomas; T. Schreier-Alt; V. Bader; J. Bauer; T. Nowak; O. Bochow-Ness; R. Aschenbrenner; M. Schneider-Ramelow; K.-D. Lang

doi:10.4071/imaps.320

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Becker, K.-F., D. Joklitschke, T. Braun, M. Koch, T. Thomas, T. Schreier-Alt, V. Bader, et al. 2012. “Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes.” Journal of Microelectronics and Electronic Packaging 9 (2): 78–86. https://doi.org/10.4071/imaps.320.

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