ISSN 1551-4897
Vol. 9, Issue 2, 2012April 01, 2012 EDT
Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes
Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes
Articles in Vol. 9, Issue 2, 2012
Vol. 9, Issue 2, 2012
- Reliability of Embedded Ultrathin Chips Subjected to Cyclic StressesFerdous SarwarVal R. Marinov
- Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board DesignsDarryl KostkaAntonio Ciccomancini Scogna
- Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTu Anh TranVarughese MathewHarold Downey
- LTCC Based Microfluidic Mass Flow Sensor ConceptChristian ZeilmannThomas HaasAndreas BackesUlrich Schmid
- Transfer Molding Technology for Smart Power Electronics Modules: Materials and ProcessesK.-F. BeckerD. JoklitschkeT. BraunM. KochT. ThomasT. Schreier-AltV. BaderJ. BauerT. NowakO. Bochow-NessR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)Heng-Chieh ChienJohn H. LauYu-Lin ChaoRa-Min TainMing-Ji DaiSheng-Tsai WuWei-Chung LoMing-Jer Kao
Becker, K.-F., D. Joklitschke, T. Braun, M. Koch, T. Thomas, T. Schreier-Alt, V. Bader, et al. 2012. “Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes.” Journal of Microelectronics and Electronic Packaging 9 (2): 78–86. https://doi.org/10.4071/imaps.320.