Vol. 9, Issue 2, 2012April 01, 2012 EDT
Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes
Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes
Becker, K.-F., D. Joklitschke, T. Braun, M. Koch, T. Thomas, T. Schreier-Alt, V. Bader, et al. 2012. “Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes.” Journal of Microelectronics and Electronic Packaging 9 (2): 78–86. https://doi.org/10.4071/imaps.320.