Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate

Burkhardt, T., M. Hornaff, A. Acker, T. Peschel, E. Beckert, K.-H. Suphan, K. Mensel, S. Jirak, R. Eberhardt, and A. Tünnermann. 2012. “Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.” Journal of Microelectronics and Electronic Packaging 9 (3): 113–19. https:/​/​doi.org/​10.4071/​imaps.334.