Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate

T. Burkhardt; M. Hornaff; A. Acker; T. Peschel; E. Beckert; K.-H. Suphan; K. Mensel; S. Jirak; R. Eberhardt; A. Tünnermann

doi:10.4071/imaps.334

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Burkhardt, T., M. Hornaff, A. Acker, T. Peschel, E. Beckert, K.-H. Suphan, K. Mensel, S. Jirak, R. Eberhardt, and A. Tünnermann. 2012. “Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.” Journal of Microelectronics and Electronic Packaging 9 (3): 113–19. https://doi.org/10.4071/imaps.334.

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