ISSN 1551-4897
Vol. 9, Issue 3, 2012July 01, 2012 EDT
Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate
Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate
Articles in Vol. 9, Issue 3, 2012
Vol. 9, Issue 3, 2012
- Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic SubstrateT. BurkhardtM. HornaffA. AckerT. PeschelE. BeckertK.-H. SuphanK. MenselS. JirakR. EberhardtA. Tünnermann
- Inkjet Printing of Multilayer CapacitorsD. JeschkeE. AhlfsK. Krüger
- Design and Fabrication of an LTCC Structure for a Microceramic CombustorDarko BelavicMarko HrovatGregor DolancKostja MakarovicMarina Santo Zarnik
- Aerosol Printing of High Resolution Films for LTCC-Multilayer ComponentsMartin IhleUwe PartschSindy MoschAdrian Goldberg
- Cold Embossing of Ceramic Green TapesAnja HärtelHans-Jürgen RichterTassilo Moritz
- Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness LossA. Ege EnginPavithra Pasunoori
Burkhardt, T., M. Hornaff, A. Acker, T. Peschel, E. Beckert, K.-H. Suphan, K. Mensel, S. Jirak, R. Eberhardt, and A. Tünnermann. 2012. “Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.” Journal of Microelectronics and Electronic Packaging 9 (3): 113–19. https://doi.org/10.4071/imaps.334.