ISSN 1551-4897
Vol. 9, Issue 4, 2012October 01, 2012 EDT
Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf,
Brunschwiler, Thomas, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, and Heiko Wolf. 2012. “Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging.” Journal of Microelectronics and Electronic Packaging 9 (4): 149–59. https://doi.org/10.4071/imaps.357.