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Vol. 9, Issue 4, 2012October 01, 2012 EDT

Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Definition Printed Electronic Devices

C. Dossou-Yovo, M. Mougenot, E. Beaudrouet, M. Bessaudou, N. Bernardin, F. Charifi, C. Coquet, M. Borella, R. Noguera, C. Modes, M. Lejeune, P. Laurier, D. Detemmerman, P. Escure, H. Laville, N. Delhotes, S. Verdeymes,
Inkjet printingMLCCprinted electronicsthick film
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.338
Journal of Microelectronics & Elect Pkg
Dossou-Yovo, C., M. Mougenot, E. Beaudrouet, M. Bessaudou, N. Bernardin, F. Charifi, C. Coquet, et al. 2012. “Inkjet Printing Technology: A Novel Bottom-up Approach for Multilayer Ceramic Components and High Definition Printed Electronic Devices.” Journal of Microelectronics and Electronic Packaging 9 (4): 187–98. https:/​/​doi.org/​10.4071/​imaps.338.
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