Vol. 7, Issue 4, 2010October 01, 2010 EDT
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
Zussman, M. P., C. Milasincic, A. Rardin, S. Kirk, and T. Itabashi. 2010. “Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling.” Journal of Microelectronics and Electronic Packaging 7 (4): 214–19. https://doi.org/10.4071/imaps.260.