Vol. 7, Issue 3, 2010July 01, 2010 EDT
A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices
A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices
Seetharaman, Krishnan, Bart van Velzen, Johannes van Wingerden, Hans van Zadelhoff, Cadmus Yuan, Frank Rietveld, Coen Tak, Joost van Beek, Peter H.C. Magnée, and Herman C.W. Beijerinck. 2010. “A Robust Thin-Film Wafer-Level Packaging Approach for MEMS Devices.” Journal of Microelectronics and Electronic Packaging 7 (3): 175–80. https://doi.org/10.4071/imaps.270.