Vol. 7, Issue 3, 2010July 01, 2010 EDT
ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications
ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications
McCutcheon, Jeremy, Robert Brown, and JoElle Dachsteiner. 2010. “ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications.” Journal of Microelectronics and Electronic Packaging 7 (3): 138–42. https://doi.org/10.4071/imaps.269.