Next Generation System in a Package Manufacturing by Embedded Chip Technologies

Lars Boettcher; D. Manessis; S. Karaszkiewicz; A. Ostmann; H. Reichl

doi:10.4071/imaps.261

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Boettcher, Lars, D. Manessis, S. Karaszkiewicz, A. Ostmann, and H. Reichl. 2010. “Next Generation System in a Package Manufacturing by Embedded Chip Technologies.” Journal of Microelectronics and Electronic Packaging 7 (3): 131–37. https://doi.org/10.4071/imaps.261.

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