Vol. 7, Issue 3, 2010July 01, 2010 EDT
Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material
Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material
Panaccione, Paul, Tao Wang, Xu Chen, Susan Luo, and Guo-Quan Lu. 2010. “Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material.” Journal of Microelectronics and Electronic Packaging 7 (3): 164–68. https://doi.org/10.4071/imaps.264.