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Vol. 7, Issue 3, 2010
July 01, 2010 EDT
Advances in WLCSP Technologies to Enable Cost Reduction
R. Chilukuri
,
R. Anderson
,
B. Rogers
,
A. Syed
,
WLCSP
board level reliability
CSPX3
CSPX2
CSPnl
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/imaps.268
Journal of Microelectronics & Elect Pkg
Chilukuri, R., R. Anderson, B. Rogers, and A. Syed. 2010. “Advances in WLCSP Technologies to Enable Cost Reduction.”
Journal of Microelectronics and Electronic Packaging
7 (3): 160–63.
https://doi.org/10.4071/imaps.268
.
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