ISSN 1551-4897
Kim, Bruce C., and Rahim Kasim. 2010. “Development of MEMS Power Sensor Package.” Journal of Microelectronics and Electronic Packaging 7 (3): 169–74. https://doi.org/10.4071/imaps.266.
This website uses cookies
We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.
RSS Feed
Enter the URL below into your favorite RSS reader.
http://localhost:14028/feed
Powered by Scholastica, the modern academic journal management system