Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:24995/feed
General
Vol. 7, Issue 3, 2010July 01, 2010 EDT

Wafer Level Packaging of Compound Semiconductors

Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Anna Paat, Oscar Alinabon, Jing Li,
Under bump metallurgysolder bumpingcompound semiconductorsgaas
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.263
Journal of Microelectronics & Elect Pkg
Strandjord, Andrew, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Anna Paat, Oscar Alinabon, and Jing Li. 2010. “Wafer Level Packaging of Compound Semiconductors.” Journal of Microelectronics and Electronic Packaging 7 (3): 152–59. https:/​/​doi.org/​10.4071/​imaps.263.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system