Wafer Level Packaging of Compound Semiconductors

Strandjord, Andrew, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Anna Paat, Oscar Alinabon, and Jing Li. 2010. “Wafer Level Packaging of Compound Semiconductors.” Journal of Microelectronics and Electronic Packaging 7 (3): 152–59. https://doi.org/10.4071/imaps.263.