Vol. 7, Issue 3, 2010July 01, 2010 EDT
Wafer Level Packaging of Compound Semiconductors
Wafer Level Packaging of Compound Semiconductors
Strandjord, Andrew, Thorsten Teutsch, Axel Scheffler, Bernd Otto, Anna Paat, Oscar Alinabon, and Jing Li. 2010. “Wafer Level Packaging of Compound Semiconductors.” Journal of Microelectronics and Electronic Packaging 7 (3): 152–59. https://doi.org/10.4071/imaps.263.