Vol. 7, Issue 3, 2010July 01, 2010 EDT
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill
Li, Zhaozhi, Sangil Lee, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Eugene A. Stout, Theodore G. Tessier, and John L. Evans. 2010. “Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill.” Journal of Microelectronics and Electronic Packaging 7 (3): 146–51. https://doi.org/10.4071/imaps.262.