Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive

Alan Huffman; Christopher Gregory; Matthew Lueck; Jason Reed; Dorota Temple; Russ Stapleton

doi:10.4071/imaps.271

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Huffman, Alan, Christopher Gregory, Matthew Lueck, Jason Reed, Dorota Temple, and Russ Stapleton. 2010. “Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive.” Journal of Microelectronics and Electronic Packaging 7 (3): 143–45. https://doi.org/10.4071/imaps.271.

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