Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive

Huffman, Alan, Christopher Gregory, Matthew Lueck, Jason Reed, Dorota Temple, and Russ Stapleton. 2010. “Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive.” Journal of Microelectronics and Electronic Packaging 7 (3): 143–45. https:/​/​doi.org/​10.4071/​imaps.271.