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Vol. 7, Issue 3, 2010July 01, 2010 EDT

Fabrication and Electrical Evaluation of Via Last Polymer Liner TSVs

Deniz S. Tezcan, Bivragh Majeed, Yann Civale, Philippe Soussan, Eric Beyne,
Through silicon via (TSV)3D integrationwafer level packaging (WLP)polymer liner
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.272
Journal of Microelectronics & Elect Pkg
Tezcan, Deniz S., Bivragh Majeed, Yann Civale, Philippe Soussan, and Eric Beyne. 2010. “Fabrication and Electrical Evaluation of Via Last Polymer Liner TSVs.” Journal of Microelectronics and Electronic Packaging 7 (3): 125–30. https:/​/​doi.org/​10.4071/​imaps.272.
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