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Vol. 7, Issue 3, 2010July 01, 2010 EDT

Integration of Electrografted Layers for the Metallization of Deep TSVs

F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier, C. Truzzi,
Electrograftingthrough-silicon-viasmetallization
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.259
Journal of Microelectronics & Elect Pkg
Raynal, F., V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier, and C. Truzzi. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” Journal of Microelectronics and Electronic Packaging 7 (3): 119–24. https:/​/​doi.org/​10.4071/​imaps.259.
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