Integration of Electrografted Layers for the Metallization of Deep TSVs

F. Raynal; V. Mevellec; N. Frederich; D. Suhr; I. Bispo; B. Couturier; C. Truzzi

doi:10.4071/imaps.259

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Raynal, F., V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier, and C. Truzzi. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” Journal of Microelectronics and Electronic Packaging 7 (3): 119–24. https://doi.org/10.4071/imaps.259.

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