Vol. 7, Issue 3, 2010July 01, 2010 EDT
Integration of Electrografted Layers for the Metallization of Deep TSVs
Integration of Electrografted Layers for the Metallization of Deep TSVs
Raynal, F., V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier, and C. Truzzi. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” Journal of Microelectronics and Electronic Packaging 7 (3): 119–24. https://doi.org/10.4071/imaps.259.