Integration of Electrografted Layers for the Metallization of Deep TSVs

F. Raynal; V. Mevellec; N. Frederich; D. Suhr; I. Bispo; B. Couturier; C. Truzzi

doi:10.4071/imaps.259

Raynal, F., V. Mevellec, N. Frederich, D. Suhr, I. Bispo, B. Couturier, and C. Truzzi. 2010. “Integration of Electrografted Layers for the Metallization of Deep TSVs.” Journal of Microelectronics and Electronic Packaging 7 (3): 119–24. https://doi.org/10.4071/imaps.259.

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