Thermomechanical Stresses in Copper Films at Elevated Temperature

Lederer, Martin, Javad Zarbakhsh, Rui Huang, Thomas Detzel, and Brigitte Weiss. 2010. “Thermomechanical Stresses in Copper Films at Elevated Temperature.” Journal of Microelectronics and Electronic Packaging 7 (2): 99–104. https:/​/​doi.org/​10.4071/​1551-4897-7.2.99.