Thermomechanical Stresses in Copper Films at Elevated Temperature

Martin Lederer; Javad Zarbakhsh; Rui Huang; Thomas Detzel; Brigitte Weiss

doi:10.4071/1551-4897-7.2.99

Loading [Contrib]/a11y/accessibility-menu.js

Lederer, Martin, Javad Zarbakhsh, Rui Huang, Thomas Detzel, and Brigitte Weiss. 2010. “Thermomechanical Stresses in Copper Films at Elevated Temperature.” Journal of Microelectronics and Electronic Packaging 7 (2): 99–104. https://doi.org/10.4071/1551-4897-7.2.99.

View more stats