Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions

Ramesham, Rajeshuni, Amarit Kitiyakara, Richard Redick, and Eric T. Sunada. 2010. “Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions.” Journal of Microelectronics and Electronic Packaging 7 (2): 67–72. https://doi.org/10.4071/1551-4897-7.2.67.