Vol. 7, Issue 2, 2010April 01, 2010 EDT
Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions
Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions
Ramesham, Rajeshuni, Amarit Kitiyakara, Richard Redick, and Eric T. Sunada. 2010. “Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions.” Journal of Microelectronics and Electronic Packaging 7 (2): 67–72. https://doi.org/10.4071/1551-4897-7.2.67.