ISSN 1551-4897
Vol. 7, Issue 2, 2010April 01, 2010 EDT
Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions
Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions
Articles in Vol. 7, Issue 2, 2010
Vol. 7, Issue 2, 2010
- Low Frequency Noise and TCR Mechanisms in Polymer Thick Film ResistorsB. PoornaiahG. Srinivasa RaoA.V. Prathap KumarY. Srinivasa Rao
- Accelerated Tests for the Effects of Power Cycling on Tantalum Capacitors in a Humid EnvironmentJ. VirkkiP. Raumonen
- Response Time Analysis of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric CoolersHuy N. PhanDereje Agonafer
- Effects of Nonuniform Base Heating on Single Stack and Multi-Stack Microchannel Heat Sinks Used for Electronics CoolingPradeep HegdeK.N. Seetharamu
- Thermomechanical Stresses in Copper Films at Elevated TemperatureMartin LedererJavad ZarbakhshRui HuangThomas DetzelBrigitte Weiss
- Cooling Management of Highly Powered Chips Packed in an Insulated Cavity Filled with a Phase Change MaterialMustapha Faraji
- Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space MissionsRajeshuni RameshamAmarit KitiyakaraRichard RedickEric T. Sunada
Ramesham, Rajeshuni, Amarit Kitiyakara, Richard Redick, and Eric T. Sunada. 2010. “Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions.” Journal of Microelectronics and Electronic Packaging 7 (2): 67–72. https://doi.org/10.4071/1551-4897-7.2.67.