Vol. 7, Issue 2, 2010April 01, 2010 EDT
Cooling Management of Highly Powered Chips Packed in an Insulated Cavity Filled with a Phase Change Material
Cooling Management of Highly Powered Chips Packed in an Insulated Cavity Filled with a Phase Change Material
Faraji, Mustapha. 2010. “Cooling Management of Highly Powered Chips Packed in an Insulated Cavity Filled with a Phase Change Material.” Journal of Microelectronics and Electronic Packaging 7 (2): 79–89. https://doi.org/10.4071/1551-4897-7.2.79.