Vol. 7, Issue 2, 2010April 01, 2010 EDT
Response Time Analysis of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Response Time Analysis of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Phan, Huy N., and Dereje Agonafer. 2010. “Response Time Analysis of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers.” Journal of Microelectronics and Electronic Packaging 7 (2): 73–78. https://doi.org/10.4071/1551-4897-7.2.73.