ISSN 1551-4897
Vol. 7, Issue 1, 2010January 01, 2010 EDT
Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni Substrates
Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni Substrates
Han, Chunfen, Qi Liu, and Douglas G. Ivey. 2010. “Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni Substrates.” Journal of Microelectronics and Electronic Packaging 7 (1): 48–57. https://doi.org/10.4071/1551-4897-7.1.48.